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Your search returned 12 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1997 Volume number : 20 Issue: 01 |
Interation Of Vapor Deposited Polyimide Into A Multichip Module Packaging Process
(Article)
Subject:
Infrared Spectroscopy
,
Multichip Module
,
Polyimide
,
Refractive Index Change
Author:
M.A.
Liberman
Vincent
Malba
Anthony F.
Bernhardt
page:
13
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16
Implementation Of Gallium Arsenide Multichip Digital Circuit Operating At 500-1000 Mhz Clook Rates Using A Si/Cu/Sio2 Mcm-D Technology
(Article)
Subject:
Digital Signal Processor
,
Gallium Arsenide
,
Power Plant
Author:
Barry K.
Gilbert
Barbara A.
Randall
David B.
Tuckerman
page:
17
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26
A Novel Test Technique For Mcm Substrates
(Article)
Subject:
Electrical Module Test
,
Ground Source
Author:
Bruce C
Kim
Madhavan
Swaminathan
David E
Schimmel
page:
2
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12
Multichip Mmic Package For X And Ka Bands
(Article)
Subject:
Computer Modelling
,
Ic Packages
,
Microwave Mesurements
Author:
D. Richard
Decker
Barayan Rangappa
Mysoor
Ramani
Tatikola
page:
27
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33
Fdtd Analysis Of The Electrical Performance For Interconnection Lines In Multichip Moudule (Mcm) With Perforated Reference Planes
(Article)
Subject:
Electrical Performances
,
Finite Difference Time-Domain (Fdtd) Methods
,
Interconnection Delay
Author:
Jin
Zhao
Zhengfan
Li
page:
34
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41
Modeling And Experimental Verfication Of The Interconneted Mesh Power System (Imps) Mcm Topology
(Article)
Subject:
Ac Noise
,
3-D Field Solver
,
Transmission Lines
Author:
Yee L.
Low
Leonard W/.
Schaper
Simon S.
Ang
page:
42
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49
Return Path Inductance In Measurements Of Package Inductance Matrixes
(Article)
Subject:
Bandwidth
,
Inductance Model
,
Partial Burn
,
Repeatability
Author:
Brian
Young
page:
50
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55
Package Clock Distribution Design Optimization For High-Speed And Low-Power Vlsi'S
(Article)
Subject:
Clock Distribution
,
Clock Networks
,
Clock Skew
Author:
Qinghua
Zhu
Simon
Tam
page:
56
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63
Electrical Characteristics Of High-Performance Pin-In-Socket And Pad-On-Pad Connectors
(Article)
Subject:
Pin-Loaded Tubes
,
Pad-On-Pad Connectors
Author:
A.
Deutsch
Jacqueline
Campbell
Alan
Knight
page:
64
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77
Reliability Of Laminate From Advanced Copna-Resin/E-Glass Fabrics System
(Article)
Subject:
Advanced Computation
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Reliability
,
Tg
Author:
Kazunari
Nawa
Masakazu
Ohkita
page:
78
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86
Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints
(Article)
Subject:
Surface Morphology
,
Thermal Cycle Stability
Author:
P, L,
Tu
Y. N
Chan
J
Lai
page:
87
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93
Thermal Limits Of Flip Chip Package Experimentally Valisated Cfd Supported Case Studies
(Article)
Subject:
Thermal Resistance
,
Computational Fluid Dynamics (Cfd)
,
Thermal Liquefaction
Author:
Tien-Yu
Tom Lee
Mali
Mahalingam
page:
94
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103
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